Gigabyte B560M DS3H AC
GIGABYTE B560M DS3H AC ready motherboards with enhanced sound quality and support, high speed networking and the latest WIFI standard design on select models GIGABYTE motherboards are ideal for users looking to build the best systems in the market.
Features of Gigabyte B560M DS3H AC Motherboard
Intel® Ultra Durable B560 Motherboard with 6+2 Phase Digital VRM, Full PCIe 4.0*, PCIe 4.0 M.2, Dual Band 802.11ac WIFI, GIGABYTE 8118 Gaming LAN, 8-ch HD Audio with Audio Caps, USB TYPE-C®, RGB FUSION 2.0, Q-Flash Plus
Supports 11th and 10th generation Intel® Core™ processors
Dual Channel DDR4 Non-ECC Memory, DDR4 4 DIMM
6+2 Phase Direct Digital Voltage Regulatory Module Solution with Low RDS MOSFETs (Powered On)
Dual Ultra-Speed NVMe PCIe 4.0 / 3.0 * x4 M.2
Gigabyte 8118 exclusive gaming LAN with bandwidth management
Dual Band 802.11ac Wireless and BT 4.2 with WIFI Antenna
USB 3.2 Gen1 Type-C® for fast, versatile connections
High quality audio capacitors and Audio Noise Reduction
RGB FUSION 2.0 software supports customizable LED and RGB LED strips
Smart Fan 6 features multiple temperature sensors, and hybrid fan connections with FAN STOP
Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
The cleaner and more efficient power delivery to the CPU with better thermal performance ensures stability under high CPU frequencies and heavy load.
Digital PWM controller to supply the appropriate voltage to the CPU.
6-phase + 2-phase low RDS MOSFET circuits (on) without PWM servo, each power phase connected directly to the CPU.
All solid capacitors to improve transient response and reduce oscillation.
8-pin solid CPU power connector.
Smart Fan 6 has many unique cooling features that ensure that your gaming PC maintains its performance while staying cool and quiet. Multiple fan connectors can support a PWM/DC fan and pump, and users can easily select each fan curve based on different temperature sensors across the board via an intuitive user interface.
High current support with Gigabyte B560M DS3H AC
All fan headers support PWM and DC fan and water cooling pump, and up to 24W (12V x 2A) with overcurrent protection
precise control
Up to 7 point temperature/fan speed control for precise fan curve
double curve mode
Double ramp/stair mode for different user scenario
fan stop
The fan can stop completely under the users set temperature
Dual PCIe 4.0/3.0 x4 M.2 Connectors with Gigabyte B560M DS3H AC
GIGABYTE Ultra Durable motherboards focus on delivering M.2 technology to enthusiasts who want to maximize the capabilities of their systems.
PCIe 4.0 support varies by processor installed, please refer to product specifications for more details.
RGB FUSION 2.0.0 Update with Gigabyte B560M DS3H AC
With the B560 motherboard, RGB Fusion 2.0 is even better with its addressable LEDs. * RGB Fusion 2.0 software provides users with the option to control built-in RGB and controllable external RGB/LED light strips for their PC. The RGB Fusion 2.0 technology on B560 Series motherboards is already packed with color and patterns, and is now upgraded with Addressable LED support. With external addressable LED strips*, where each LED can be digitally oriented, users can experience more patterns, patterns, and lighting.
With the B560 motherboard it will support either 5V or 12V addressable LED light strips and up to 300 LEDs. RGB Fusion 2.0 software with addressable LEDs comes with new patterns and different speed settings with more to come.
Solid Pin Power Connectors with Gigabyte B560M DS3H AC
B560 motherboards feature solid ATX 12V 8pin power connectors to provide a stable power supply during CPU overload.
Advantages of solid power connector
Larger connection area for electricity
More metal to conserve more energy and generate heat
Ultra durable and long life
BIOS Update with Gigabyte B560M DS3H AC
BIOS is necessary for users during the initial setup to allow for optimal settings. With a new graphic user interface and easier-to-use functionality, GIGABYTE has been able to reinvent the BIOS to give users a better experience while setting up their new system. * Pictures are for reference only. Product features may vary by model.
Gigabyte B560M DS3H AC motherboard specifications
- CPU
LGA1200 package:
11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*
Limited to processors with 4 MB Intel® Smart Cache, Intel® Celeron® G5xx5 family.
L3 cache varies with CPU
(Please refer to “CPU Support List” for more information.) - Chipset
Intel® B560 Express Chipset - Memory
11th Generation Intel® Core™ i9/i7/i5 processors:
Support for DDR4 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz
10th Generation Intel® Core™ i9/i7 processors:
Support for DDR4 2933/2666/2400/2133 MHz memory modules
10th Generation Intel® Core™ i5/i3/Pentium®/Celeron® processors:
Support for DDR4 2666/2400/2133 MHz memory modules
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(Go to GIGABYTE’s website for the latest supported memory speeds and memory modules.) - Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
Support for DisplayPort 1.2 version and HDCP 2.3
When the D-Sub port and DisplayPort are connected at the same time, images will output from the DisplayPort only.
1 x HDMI port, supporting a maximum resolution of 4096×2160@30 Hz
Support for HDMI 1.4 version and HDCP 2.3.
(Graphics specifications may vary depending on CPU support.) - Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings Playback Device to change the default setting first. - LAN
Realtek® GbE LAN chip (1000/100 Mbit) - Wireless Communication module
AzureWave Wi-Fi AW-CB304NF (Realtek® RTL8821CE)
WIFI 802.11a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band
BLUETOOTH 4.2
Support for 11ac wireless standard and up to 433 Mbps data rate
Actual data rate may vary depending on environment and equipment. - Expansion Slots
1 x PCI Express x16 slot, running at x16
(The PCIEX16 slot conforms to PCI Express 4.0 standard.) (Note)
2 x PCI Express x1 slots
(The PCIEX1 slot conforms to PCI Express 3.0 standard.) - Storage Interface
- CPU:
1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) (Note) - Chipset:
1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/ x2 SSD support) (M2A_SB)
6 x SATA 6Gb/s connectors
Refer to “1-7 Internal Connectors,” for the installation notices for the M.2 and SATA connectors.
Intel® Optane™ Memory Ready
System acceleration with Intel® Optane™ Memory can only be enabled on the M2P_CPU connector and with an 11th Generation Intel® processor installed. - USB
Chipset:
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 1 support
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
4 x USB 2.0/1.1 ports available through the internal USB headers
Chipset+USB 2.0 Hub:
2 x USB 2.0/1.1 ports on the back panel
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
6 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x Clear CMOS jumper
1 x Q-Flash Plus button
All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W. - Back Panel Connectors
2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (1T1R)
1 x DisplayPort
1 x HDMI port
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 1 support
1 x RJ-45 port
3 x audio jacks - I/O Controller
iTE® I/O Controller Chip - H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Fan fail warning
Fan speed control
Whether the fan speed control function is supported will depend on the fan you install. - BIOS
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 - Unique Features
Support for APP Center
Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
@BIOS
EasyTune
Fast Boot
Game Boost
ON/OFF Charge
RGB Fusion
Smart Backup
System Information Viewer
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install - Bundled Software
Norton® Internet Security (OEM version)
Realtek® 8118 Gaming LAN Bandwidth Control Utility - Operating System
Support for Windows 10 64-bit - Form Factor
Micro ATX Form Factor; 24.4cm x 24.4cm - Note
Supported by 11th Generation processors only. - Remark
Due to different Linux support condition provided by chipset vendors, please download Linux driver from chipset vendors’ website or 3rd party website.
Most hardware/software vendors may no longer offer drivers to support Win9X/ME/2000/XP. If drivers are available from the vendors, we will update them on the GIGABYTE website.
Gigabyte B560M DS3H AC motherboard price in Egypt
The price of the Gigabyte B560M DS3H AC motherboard ranges globally in the range of 5000 dollars or its equivalent in local currency
The price of the Gigabyte B560M DS3H AC motherboard in Egypt is currently in the medium economic category, which is suitable for most students, employees and companies
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